April was a month of meaningful production milestones for SixSense. We deepened our deployments across backend and wafer fab environments, demonstrated measurable yield recovery at scale, and expanded our customer base into specialty foundry manufacturing in Taiwan.
Key highlights included partnering with Wavetek Microelectronics to bring AI into compound semiconductor production, launching Fast Die Registration technology for dramatically more accurate AI inspection, and going live as the first-check classifier at post wire bond inspection for a global semiconductor manufacturer with over 99.3% accuracy and zero escapes.
Together, these milestones reflect our continued focus: making production-grade AI practical, scalable, and immediately impactful across fabs and packaging lines in semiconductors.
Wavetek Microelectronics Partners with SixSense
Wavetek Microelectronics Corporation, a Taiwan-based specialty foundry with deep expertise in compound semiconductors and photonics, has partnered with SixSense to bring AI into its 6-inch wafer fab operations.
Operating across technologies such as GaN, GaAs, and TFLN, Wavetek focuses on high-performance manufacturing where precision and speed are critical. With SixSense, they are building a more intelligent production environment where manufacturing data can drive faster decisions, improve consistency, and strengthen process learning over time.
This collaboration also supports the commercialization of TFLN photonics for Wavetek, enabling its transition from R&D to customer-qualified production for AI and cloud infrastructure.
The partnership reflects a broader shift toward deploying scalable, production-ready AI across semiconductor manufacturing environments.
New Launch: Fast Die Registration for AI Inspection
We're excited to announce the release of our Fast Die Registration technology — a breakthrough that makes AI-based chip inspection dramatically more accurate.
Inspection tools compare two "identical" chips and flag any differences as defects but even a tiny shift between the two images throws the system off, and good chips end up rejected.
Fast Die Registration aligns the two images with extreme precision in just 5 milliseconds , about 60× faster than conventional approaches, and fast enough to run on every chip in real production without slowing the line down.
Paired with our AI inspection system, the impact is sharp: ~50× fewer false alarms and ~500× fewer missed defects compared to traditional inspection.
Read about the technology here:
https://www.sixsense.ai/blog/die-to-die-registration-semiconductor-defect-detection-ai
AI-ADC Takes Over as the First-Check at Inspection — 0% Escapes, <0.4% Overkill
We're pleased to share that Sixsense AI-ADC went live as the first-check at post wire bond inspection for a global semiconductor manufacturer running high-volume backend assembly in Southeast Asia — fully bypassing OEM classification.
The customer had been struggling with escapes and over-rejection from their OEM setup. Their in-house classifier, built through both supervised and unsupervised approaches, couldn't generalize on production data, leaving them with very high over-rejection and a manual human review step just to salvage the good units.
Running at production speed, Sixsense AI-ADC delivered:
- Over 99.3% accuracy
- 0% escapes
- Over-rejection below 0.4%
The model was trained with as little as 20 images for certain defects using Sixsense's pretrained foundation model, and launched in under two days through our self-service UI, recovering a significant volume of good units that were previously being scrapped.
A strong proof point for what production-grade, customer-operable AI can achieve on the line.
Read more about the deployment here:
https://www.sixsense.ai/blog/from-over-rejection-to-precision-ai-adc-at-post-wire-bond-inspection/